Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.
Some of the product specs:
– MCAD and ECAD Support
– Solar radiation
– Parametrics and Optimization
– Customization and Automation
– Network Modeling
– DC Joule Heating Analysis
– Electro-thermal and Thermo-Mechanical
– Extensive Libraries for Thermal
– Liquid Cooling
– Dynamic Thermal Management
– Varying Flow and Power ROM
